How to choose between low temperature solder paste, medium temperature solder paste and high temperature solder paste?
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How to choose between low temperature solder paste, medium temperature solder paste and high temperature solder paste?

Views: 1     创始人: Site Editor     Publish Time: 2024-09-28      Origin: Site

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When selecting low-temperature, medium-temperature and high-temperature solder pastes, it is critical to consider a number of aspects such as the temperature required for soldering, the applicable application environment, and the heat resistance of the components.

 

The following are suggestions for selecting these three types of solder pastes: 1. Please provide specific paragraph content so that I can modify it. Low-temperature solder pastes: Their melting point is usually located near 138°C, with peak temperatures between 170 and 200°C during reflow soldering. This type of solder paste is suitable for soldering temperature sensitive components such as plastic encapsulated components and other assemblies that are sensitive to high temperature environments. Low-temperature solder pastes are mainly composed of SnIn system, SnBi system, SnBiAg system, etc., and contain trace amounts of silver, copper, antimony and other elements, these micro-alloyed components together constitute a low-temperature solder with high reliability. Medium Temperature Solder Paste Overview: The melting point of this type of solder paste usually ranges from 180°C to 220°C, and its peak reflow soldering temperature is controlled between 210°C and 260°C. The melting point of this type of solder paste is usually between 180°C and 220°C, and its peak reflow soldering temperature is controlled between 210°C and 260°C. Medium temperature solder pastes are widely used in soldering operations for all types of electronic components due to their suitable soldering characteristics and are suitable for the manufacture of most electronic products. The product line includes leaded Sn63Pb37 solder pastes, lead-free SnAgCu (SAC305) alloys, and high-reliability medium-temperature solder based on SnAgCu alloys designed to optimize reliability. High-temperature solder pastes: Their melting point generally exceeds 240°C, with peak temperatures between 270 and 360°C during reflow soldering. These pastes are used in scenarios where high temperature soldering is required, such as power modules, automotive electronics, and devices that need to operate in a high temperature environment. The high-temperature solder paste market is dominated by high-lead solders (more than 90% lead), while high-temperature lead-free SnSb and AuSn alloy pastes are also quite common. In recent years, some solder manufacturers have begun to introduce new high-temperature lead-free alloy solders to replace traditional high-lead solders. The peak reflow temperature of these new solders is usually 350 to 360 ° C, and the solder joint temperature resistance can reach more than 280 ° C. 2.

   2. Overview of soldering technologies Low-temperature solder pastes: particularly suitable for low-temperature reflow soldering techniques, which can significantly reduce the damage caused by thermal stress on electronic components. Medium temperature solder pastes: ideal for standard reflow processes and widely used in the industry. High-temperature solder paste: designed for high-temperature reflow process, effectively ensuring that the solder joints still show excellent electrical and mechanical properties under high-temperature conditions.

3. Components and printed circuit board (PCB) material selection Low temperature solder paste is particularly suitable for soldering temperature-sensitive components, including LED lights and plastic package type electronic components. Medium temperature solder paste is suitable for most standard components and PCB board soldering. High-temperature solder pastes are particularly suitable for components that operate at high temperatures, as well as for special types of PCB substrate materials, such as ceramic substrates and copper support substrates.

4. Application range Low temperature solder paste is suitable for: consumer electronics, LED lighting equipment, wearable devices and flexible printed circuit boards (FPC) and other fields. Medium temperature solder paste is suitable for communication equipment, household appliances, computers and their peripheral equipment and other fields. High-temperature solder paste is suitable for: automotive electronics, industrial control systems, aerospace and military equipment, high-performance power devices and other fields. 5. Cost analysis and management Low-temperature solder paste is more cost-effective, especially suitable for low-cost electronic product production. Medium temperature solder paste is moderately priced, widely used in the manufacture of various types of electronic products. High-temperature solder pastes are relatively expensive and are mainly used for products that require high quality and reliability, and need to be operated in conjunction with secondary encapsulation technology. When selecting solder paste, it is necessary to fully consider the soldering temperature, process specifications, the characteristics of components and PCB materials, application scenarios and cost factors. Generally speaking, medium temperature solder paste should be prioritized because of its wide applicability and ability to meet the soldering needs of most electronic products. If the project has specific requirements on temperature or process, low or high temperature solder paste should be considered to adapt to the special needs. Here, Neufeld Electronic Technology strongly recommends Neufeld's high/medium/low temperature solder paste series. Nofert solder paste products are known for their excellent quality, specific advantages include: high sphericity, uniform particle size distribution, excellent wetting performance, adjustable viscosity, which can adapt to the diversified application needs. In addition, NOFIDA also provides customized services, and can customize solder pastes with special alloy compositions and particle sizes to meet specific customer needs. If you are interested in Nofert's high/medium/low temperature solder paste products, or need more product details and technical support, please feel free to contact us. Our technical support team consists of professional engineers who will provide you with accurate and professional advice and assistance to ensure that you select the solder paste that best meets your needs. 

We are mainly engaged in the research, development and production of solder paste, tin ball, electronic flux, industrial cleaning agent, lead-free solder wire, solder bar, solder sheet, and insulating varnish. The sales network covers all provinces of China and more than ten countries and regions in the world.

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